Pulse Reverse Plating of Copper Micro-Structures in Magnetic Gradient Fields

Micro-structured copper layers are obtained from pulse-reverse electrodeposition on a planar gold electrode that is magnetically patterned by magnetized iron wires underneath. 3D numerical simulations of the based an adapted reaction kinetics able to nicely reproduce micro-structure deposit layer, despite height values still remain underestimated. It shown structuring enabled magnetic gradient force, which generates local flow supports deposition and hinders dissolution in regions high gradients. The Lorentz force originating radial field components near rim causes circumferential cell flow. resulting secondary flow, however, superseded driven vicinity wires. Finally, role solutal buoyancy effects discussed better understand limitations structured growth different modes geometries.